| Item | Requirement | Test Method | ||||||
| Bending Strength | As Spec. | JIS-C-5201-1 6.1.4Bending Amplitude 3mm for 10 seconds | ||||||
| Insulation Resistance | >1000M | MIL-STD-202 Method 302Apply 100VDCfor 1minute | ||||||
| Dielectric Withstand Voltage | By type | MIL-STD-202 Method 301 Apply Max Overload Voltage for 1 minute | ||||||
| Solderability | 95% min. coverage | MIL-STD-202 Method 208H 245℃±5℃， 3±0.5(sec） | ||||||
| Resistance to Soldering Heat | △L≦10% | MIL-STD-202 Method 210E 260±5℃, 10±1 seconds | ||||||
| High Temperature Exposure | △L≦10% | JIS-C-5201-1 7.285±2°C, 1000 +48/-0 hours | ||||||
| Low Temperature Storage | △L≦10% | JIS-C-5201-1 7.1-40±3°C, 1000 +48/-0 hours | ||||||
| Moisture Resistance | △L≦10% | MIL-STD-202 Method 103B 40±2℃, 90~95%RH, 1000 +48/-0 hours | ||||||
| Temperature Cycle | △L≦10% | JIS-C-5201-1 7.4-40/RT/85/RT, 10 cycles | ||||||
| ＊Storage Temperature :25±3℃; Humidity <80%RH | ||||||||
